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IRF1407S/LPBF View Datasheet(PDF) - Infineon Technologies

Part NameDescriptionManufacturer
IRF1407S/LPBF HEXFET® Power MOSFET Infineon
Infineon Technologies Infineon
IRF1407S/LPBF Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
IRF1407SPbF
IRF1407LPbF
Benefits
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
Description
Advanced HEXFET® Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized device
design that HEXFET power MOSFETs are well known for,
provides the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in any
existing surface mount package. The D2Pak is suitable for high
current applications because of its low internal connection
resistance and can dissipate up to 2.0W in a typical surface
mount application.
The through-hole version (IRF1407L) is available for low-profile
applications.
HEXFET® Power MOSFET
VDSS
RDS(on)
ID
75V
0.0078
100A
D
D
S
G
D2 Pak
IRF1407SPbF
S
GD
TO-262 Pak
IRF1407LPbF
G
Gate
D
Drain
S
Source
Base part number
IRF1407LPbF
IRF1407SPbF
Package Type
TO-262
D2-Pak
Standard Pack
Form
Quantity
Tube
50
Tape and Reel Left
800
Orderable Part Number
IRF1407LPbF (Obsolete)
IRF1407STRLPbF
Absolute Maximum Ratings
Symbol
Parameter
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C
IDM
PD @TA = 25°C
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current 
Maximum Power Dissipation
PD @TC = 25°C
Maximum Power Dissipation
Linear Derating Factor
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited) 
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
TJ
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Mounting torque, 6-32 or M3 screw
Max.
100
70
520
3.8
200
1.3
± 20
390
See Fig.15,16, 12a, 12b
4.6
-55 to + 175
300
10 lbf•in (1.1N•m)
Units
A
W
W
W/°C
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Symbol
Parameter
RJC
Junction-to-Case
RJA
Junction-to-Ambient ( PCB Mount, steady state)
Typ.
–––
–––
Max.
0.75
40
Units
°C/W
1
2016-5-26
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