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TEA1530AP View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
TEA1530AP
NXP
NXP Semiconductors. NXP
TEA1530AP Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
NXP Semiconductors
TEA1530T/AT/AP
GreenChip II SMPS control IC
Table 3: Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground (pin 2); positive currents flow into the chip; pin VCC may not be current driven.
The voltage ratings are valid provided other ratings are not violated; current ratings are valid
provided the maximum power rating is not violated.
Symbol Parameter
Conditions
Min
Max Unit
General
Ptot
total power dissipation
Tamb < 70 °C
SO8 package
-
0.5
W
DIP8 package
-
0.75 W
Tstg
Tj
ESD
storage temperature
junction temperature
55
+150 °C
20
+145 °C
VESD
electrostatic discharge
voltage
class 1
human body model
pins 1 to 6
[1] -
2000 V
pin 8 (DRAIN)
[1] -
1500 V
machine model
[2] -
200
V
[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kseries resistor.
[2] Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 resistor.
9. Thermal characteristics
Table 4. Thermal characteristics
Symbol
Parameter
Conditions
Typ
Rth(j-a)
thermal resistance from junction to ambient. in free air, SO8 package.
150
in free air, DIP8 package
95
Unit
K/W
K/W
10. Characteristics
Table 5: Characteristics
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min Typ Max Unit
Start-up current source (pin DRAIN)
IDRAIN
current on pin DRAIN
VDRAIN > 100 V
VCC = 0 V
with auxiliary supply
1.0 1.2 1.4 mA
-
100 300 µA
VBR
Vmains(oper)(en)
breakdown voltage
mains-dependent
operation-enabling voltage
650 -
60
-
-
V
100 V
Supply voltage management (pin VCC)
Vstartup
start-up voltage
Vth(UVLO)
undervoltage lockout threshold
voltage
10.3 11
8.1 8.7
11.7 V
9.3 V
TEA1530T_AT_AP_1
Product data sheet
Rev. 01 — 30 June 2008
© NXP B.V. 2008. All rights reserved.
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