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FDN359AN View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
Manufacturer
FDN359AN
Fairchild
Fairchild Semiconductor Fairchild
FDN359AN Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Electrical Characteristics (TA = 25 OC unless otherwise noted )
Symbol
Parameter
Conditions
OFF CHARACTERISTICS
Min Typ Max Units
BVDSS
BVDSS/TJ
IDSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Zero Gate Voltage Drain Current
IGSSF
Gate - Body Leakage, Forward
IGSSR
Gate - Body Leakage, Reverse
ON CHARACTERISTICS (Note)
VGS = 0 V, ID = 250 µA
ID = 250 µA, Referenced to 25 oC
30
23
V
mV/ oC
VDS = 24 V, VGS = 0 V
1
µA
TJ = 55°C
10
µA
VGS = 20 V,VDS = 0 V
VGS = -20 V, VDS = 0 V
100 nA
-100 nA
VGS(th)
VGS(th)/TJ
RDS(ON)
Gate Threshold Voltage
Gate Threshold Voltage Temp. Coefficient
Static Drain-Source On-Resistance
ID(ON)
On-State Drain Current
gFS
Forward Transconductance
DYNAMIC CHARACTERISTICS
VDS = VGS, ID = 250 µA
ID = 250 µA, Referenced to 25 oC
VGS = 10 V, ID = 2.7 A
VGS = 4.5 V, ID = 2.4 A
VGS = 10 V, VDS = 5 V
VDS = 5 V, ID = 2.7 A
TJ =125°C
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS (Note)
VDS = 10 V, VGS = 0 V,
f = 1.0 MHz
tD(on)
Turn - On Delay Time
tr
Turn - On Rise Time
VDD = 5 V, ID = 1 A,
VGS = 4.5 V, RGEN = 6
tD(off)
Turn - Off Delay Time
tf
Turn - Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS = 10 V, ID = 2.7 A,
VGS = 5 V
Qgd
Gate-Drain Charge
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
1 1.6
3
V
-4
mV/ oC
0.037 0.046
0.055 0.075
0.049 0.06
15
A
9.5
S
480
pF
120
pF
45
pF
6
12
ns
13 24
ns
15 27
ns
4
10
ns
5
7
nC
1.4
nC
1.6
nC
IS
VSD
Note:
Maximum Continuous Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage
VGS = 0 V, IS = 0.42 A (Note)
0.42
A
0.65 1.2
V
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by
design while RθCA is determined by the user's board design.
Typical RθJA using the board layouts shown below on FR-4 PCB in a still air environment :
a. 250oC/W when mounted on
a 0.02 in2 pad of 2oz Cu.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
b. 270oC/W when mounted on
a minimum pad.
FDN359AN Rev.C
 

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