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74LVT2244MTC_99 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
Manufacturer
74LVT2244MTC_99
Fairchild
Fairchild Semiconductor Fairchild
74LVT2244MTC_99 Datasheet PDF : 6 Pages
1 2 3 4 5 6
July 1999
Revised August 1999
74LVT2244 • 74LVTH2244
Low Voltage Octal Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT2244 and LVTH2244 are octal buffers and line
drivers designed to be employed as memory address driv-
ers, clock drivers and bus oriented transmitters or receivers
which provides improved PC board density. The equivalent
25-Series resistors helps reduce output overshoot and
undershoot.
The LVTH2244 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These octal buffers and line drivers are designed for low-
voltage (3.3V) VCC applications, but with the capability to
provide a TTL interface to a 5V environment. The LVT2244
and LVTH2244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Features
s Input and output interface capability to systems at
5V VCC
s Equivalent 25-Series resistors on outputs
s Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs (74LVTH2244), also
available without bushold feature (74LVT2244).
s Live insertion/extraction permitted
s Power Up/Down high impedance provides glitch-free
bus loading
s Outputs source/sink 12 mA/+12 mA
s Latch-up performance exceeds 500 mA
Ordering Code:
Order Number Package Number
Package Description
74LVT2244WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74LVT2244SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT2244MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH2244WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74LVTH2244SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH2244MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Connection Diagram
IEEE/IEC
© 1999 Fairchild Semiconductor Corporation DS012170
www.fairchildsemi.com
 

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