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FDS6892AZ View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
Manufacturer
FDS6892AZ Datasheet PDF : 5 Pages
1 2 3 4 5
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
∆BVDSS
∆TJ
IDSS
IGSSF
IGSSR
Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA
20
Breakdown Voltage Temperature
Coefficient
ID = 250 µA, Referenced to 25°C
Zero Gate Voltage Drain Current
VDS = 16 V, VGS = 0 V
VDS = 16 V, VGS = 0 V, TJ = 55°C
Gate–Body Leakage, Forward
VGS = 12 V, VDS = 0 V
Gate–Body Leakage, Reverse
VGS = –12 V, VDS = 0 V
V
14
mV/°C
1
µA
10
10
µA
–10 µA
On Characteristics (Note 2)
VGS(th)
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = 250 µA
0.6 1.0 1.5
V
ID = 250 µA, Referenced to 25°C
–3
mV/°C
VGS = 4.5 V, ID = 7.5 A
VGS = 2.5 V, ID = 6.5 A
VGS = 4.5 V,ID = 7.5 A,TJ = 125°C
13
18
mΩ
18 24
19 28
VGS = 4.5V, VDS = 5 V
15
A
VDS = 5 V, ID = 7.5 A
36
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 10 V, V GS = 0 V,
f = 1.0 MHz
1286
pF
305
pF
161
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
VDD = 10 V, ID = 1 A,
VGS = 4.5 V, RGEN = 6 Ω
VDS = 10 V, ID = 7.5 A,
VGS = 4.5 V
10 20
ns
14 25
ns
25 40
ns
8
16
ns
12 17
nC
2.6
nC
3
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = 1.3 A (Note 2)
1.3
A
0.7 1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 78°C/W when
mounted on a 0.5in2
pad of 2 oz copper
b) 125°C/W when
mounted on a 0.02
in2 pad of 2 oz
copper
c) 135°C/W when mounted on a
minimum mounting pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
3. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
FDS6892AZ Rev C (W)
 

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