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74LCXH162373 View Datasheet(PDF) - Fairchild Semiconductor

Part NameDescriptionManufacturer
74LCXH162373 Low Voltage 16-Bit Transparent Latch with Bushold and 26Ω Series Resistor Outputs Fairchild
Fairchild Semiconductor Fairchild
74LCXH162373 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
February 2001
Revised March 2002
74LCXH162373
Low Voltage 16-Bit Transparent Latch
with Bushold and 26Series Resistor Outputs
General Description
The LCXH162373 contains sixteen non-inverting latches
with 3-STATE outputs and is intended for bus oriented
applications. The device is byte controlled. The flip-flops
appear transparent to the data when the Latch Enable (LE)
is HIGH. When LE is LOW, the data that meets the setup
time is latched. Data appears on the bus when the Output
Enable (OE) is LOW. When OE is HIGH, the outputs are in
a high impedance state.
The LCXH162373 is designed for low voltage (2.5V or
3.3V) VCC applications with capability of interfacing to a 5V
signal environment. The 26series resistor helps reduce
output overshoot and undershoot.
The LCXH162373 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
The LCXH162373 data inputs include active bushold cir-
cuitry, eliminating the need for external pull-up resistors to
hold unused or floating data inputs at a valid logic level.
Features
s 5V tolerant control inputs and outputs
s 2.3V–3.6V VCC specifications provided
s Equivalent 26series resistors on outputs
s Bushold on inputs eliminates the need for external
pull-up/pull-down resistors
s 6.2 ns tPD max (VCC = 3.3V), 20 µA ICC max
s Power down high impedance inputs and outputs
s ±12 mA output drive (VCC = 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds 500 mA
s ESD performance:
Human body model > 2000V
Machine model > 200V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
Package
Number
Package Description
74LCXH162373GX
(Note 1)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Preliminary) [TAPE and REEL]
74LCXH162373MEA
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[RAIL]
74LCXH162373MEX
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
74LCXH162373MTD
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[RAIL]
74LCXH162373MTX
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Note 1: BGA package available in Tape and Reel only.
Logic Symbol
© 2002 Fairchild Semiconductor Corporation DS500445
www.fairchildsemi.com
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