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74LCX162374MTDX View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
Manufacturer
74LCX162374MTDX Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
February 2001
Revised August 2001
74LCX162374
Low Voltage 16-Bit D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
and 26Series Resistors
General Description
The LCX162374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
The LCX162374 is designed for low voltage (2.5V or 3.3V)
VCC applications with capability of interfacing to a 5V signal
environment. The 26series resistor in the output helps
reduce output overshoot and undershoot.
The LCX162374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Features
I 5V tolerant inputs and outputs
I 2.3V–3.6V VCC specifications provided
I Equivalent 26series resistor on outputs
I 7.0 ns tPD max (VCC = 3.3V), 20 µA ICC max
I Power down high impedance inputs and outputs
I Supports live insertion/withdrawal (Note 1)
I ±12 mA output drive (VCC = 3.0V)
I Implements patented noise/EMI reduction circuitry
I Latch-up performance exceeds 500 mA
I ESD performance:
Human body model > 2000V
Machine model > 200V
I Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number Package Number
Package Description
74LCX162374GX
(Note 2)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Preliminary) [TAPE and REEL]
74LCX162374MEA
(Note 3)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX162374MTD
(Note 3)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.
Logic Symbol
© 2001 Fairchild Semiconductor Corporation DS500442
www.fairchildsemi.com
 

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