NDD02N60Z-1G View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
NDD02N60Z-1G Datasheet PDF : 10 Pages
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NDF02N60Z, NDD02N60Z
PACKAGE DIMENSIONS
TO−220 FULLPACK, 3−LEAD
CASE 221AH
ISSUE F
E
E/2
Q
1 23
A
P
0.14 M B A M
DC
L
L1
3X b2
3X b
0.25 M B A M C
e
FRONT VIEW
SECTION D−D
B
SEATING
PLANE
A
H1
A1
NOTE 3
c
A2
SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR UNCONTROLLED IN THIS AREA.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE
PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE
MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.
LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00.
6. CONTOURS AND FEATURES OF THE MOLDED PACKAGE BODY
MAY VARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1
AND H1 FOR MANUFACTURING PURPOSES.
MILLIMETERS
DIM MIN MAX
A 4.30 4.70
A1 2.50 2.90
A2 2.50 2.90
b 0.54 0.84
b2 1.10 1.40
c 0.49 0.79
D 14.70 15.30
E 9.70 10.30
e
2.54 BSC
H1 6.60 7.10
L 12.50 14.73
L1 --- 2.80
P 3.00 3.40
Q 2.80 3.20
A
NOTE 6
NOTE 6
H1
D
D
A
ALTERNATE CONSTRUCTION
SECTION A−A
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