W25Q16DVUZIQTR View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
W25Q16DVUZIQTR Datasheet PDF : 80 Pages
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3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q16DV is offered in an 8-pin SOIC 150-mil or 208-mil (package code SN & SS), an 8-pad WSON
6x5-mm (package code ZP), an 8-pad USON 4x3-mm (package code UU), an 8-pad USON 4x4-mm
(package code UZ), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package code
SF) and a 24-ball 8x6-mm TFBGA (5x5 ball array - package code TB, 6x4 ball array – package code TC)
as shown in Figure 1a-e respectively. Package diagrams and dimensions are illustrated at the end of this
datasheet.
3.1 Pin Configuration SOIC 150 / 208-mil
Top View
/CS
1
8
DO (IO1)
/WP (IO2)
GND
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q16DV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN, SS, SV, ST)
3.2 Pad Configuration WSON 6x5-mm / USON 4X3-mm / USON 4X4-mm
Top View
/CS
18
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q16DV Pad Assignments, 8-pad WSON 6x5-mm / USON 4x3-mm (Package Code ZP,UU,UZ)
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