W25Q16DVUZIG View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W25Q16DVUZIG

3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

7.2.39 Read Security Registers (48h)............................................................................................60

7.2.40 Enable Reset (66h) and Reset (99h) ..................................................................................61

8. ELECTRICAL CHARACTERISTICS .............................................................................................. 62

8.1 Absolute Maximum Ratings (1) .......................................................................................... 62

8.2 Operating Ranges .............................................................................................................. 62

8.3 Power-Up Power-Down Timing and Requirements ........................................................... 63

8.4 DC Electrical Characteristics.............................................................................................. 64

8.5 AC Measurement Conditions ............................................................................................. 65

8.6 AC Electrical Characteristics .............................................................................................. 66

8.7 AC Electrical Characteristics (cont’d) ................................................................................. 67

8.8 Serial Output Timing........................................................................................................... 68

8.9 Serial Input Timing.............................................................................................................. 68

8.10 /HOLD Timing ..................................................................................................................... 68

8.11 /WP Timing ......................................................................................................................... 68

9. PACKAGE SPECIFICATION .......................................................................................................... 69

9.1 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 69

9.2 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 70

9.3 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 71

9.4 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72

9.5 8-Pad USON 4x3-mm (Package Code UU) ....................................................................... 73

9.6 8-Pad USON 4x4-mm (Package Code UZ) ....................................................................... 74

9.7 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 74

9.8 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 76

9.9 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 76

10. ORDERING INFORMATION .......................................................................................................... 78

10.1 Valid Part Numbers and Top Side Marking ........................................................................ 79

11. REVISION HISTORY...................................................................................................................... 80

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