W25Q32BV View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
W25Q32BV Datasheet PDF : 78 Pages
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W25Q32BV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q32BV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pin VSOP 208-mil (package
code ST), an 8-pad WSON 6x5-mm or 8x6-mm (package code ZP & ZE), an 8-pin PDIP 300-mil
(package code DA), a 16-pin SOIC 300-mil (package code SF) and 24-ball 8x6-mm TFBGAs (5x5 ball
array - package code TB, 6x4 ball array – package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 208-mil
Top View
/CS
1
8
DO (IO1)
/WP (IO2)
GND
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q32BV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS, ST)
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm
Top View
/CS
18
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q32BV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP, ZE)
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