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BCP52-10 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
BCP52-10
NXP
NXP Semiconductors. NXP
BCP52-10 Datasheet PDF : 0 Pages
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
BCP52
Conditions
in free air
BCX52
BC52PA
Rth(j-sp)
thermal resistance from
junction to solder point
BCP52
BCX52
BC52PA
Min Typ Max Unit
[1] -
-
192 K/W
[2] -
-
125 K/W
[3] -
-
93
K/W
[1] -
-
250 K/W
[2] -
-
132 K/W
[3] -
-
93
K/W
[1] -
-
298 K/W
[2] -
-
151 K/W
[3] -
-
114 K/W
[4] -
-
154 K/W
[5] -
-
76
K/W
-
-
16
K/W
-
-
16
K/W
-
-
20
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
BCP52_BCX52_BC52PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
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