M15KP22A – M15KP280CA(e3)
MAXIMUM RATINGS @ 25 ºC unless otherwise noted
Junction and Storage Temperature
Thermal Resistance, Junction to Lead @ 3/8 inch (10 mm)
lead length from body
Thermal Resistance, Junction to Ambient (1)
Peak Pulse Power Dissipation (2)
Steady-State Power Dissipation @ TL = 30 ºC 3/8 inch
(10 mm) from body
tclamping (0 volts to V(BR) min, theoretical)
Surge Peak Forward Current (3)
Solder Temperature @ 10 s
TJ and TSTG
-65 to +150
Notes: 1. When mounted on FR4 PC board with 4 mm2 copper pads (1 oz) and track width 1 mm, length 25 mm.
2. With impulse repetition rate (duty factor) of 0.01 % or less (also Figures 1 and 2).
3. At 8.3 ms half-sine wave for unidirectional devices only.
MECHANICAL and PACKAGING
CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable per MIL-STD-750, method 2026.
MARKING: Part number.
POLARITY: Cathode indicated by band. No cathode band on bidirectional devices.
TAPE & REEL option: Standard per EIA-296 (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 1.4 grams.
See Package Dimensions on last page.
(*see Hirel Non-Hermetic
Peak Pulse Power
M 15 K P 22 C A (e3)
e3 = RoHS compliant
Blank = non-RoHS compliant
A = 5% tolerance level
C = Bi-directional
Blank = Unidirectional
Stand-off Voltage Rating
(see Electrical Characteristics
RF01011, Rev. E (01/12/16)
©2016 Microsemi Corporation
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