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74ABT125D(2010) View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
74ABT125D
(Rev.:2010)
NXP
NXP Semiconductors. NXP
74ABT125D Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
12. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
74ABT125
Quad buffer; 3-state
SOT27-1
D
L
Z
e
b
14
pin 1 index
A2 A
A1
wM
b1
8
ME
c
(e 1)
MH
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
mm
4.2
0.51
3.2
1.73 0.53 0.36 19.50 6.48
1.13 0.38 0.23 18.55 6.20
inches 0.17
0.02
0.13
0.068 0.021 0.014
0.044 0.015 0.009
0.77
0.73
0.26
0.24
e
2.54
0.1
e1
7.62
0.3
L
3.60
3.05
0.14
0.12
ME
8.25
7.80
0.32
0.31
MH
10.0
8.3
0.39
0.33
w
Z (1)
max.
0.254 2.2
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT27-1
IEC
050G04
REFERENCES
JEDEC
JEITA
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 9. Package outline SOT27-1 (DIP14)
74ABT125_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 04 — 27 April 2010
© NXP B.V. 2010. All rights reserved.
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