LM317BTG View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
LM317BTG Datasheet PDF : 12 Pages
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LM317, NCV317
PACKAGE DIMENSIONS
D2PAK−3
D2T SUFFIX
CASE 936−03
ISSUE E
K
A
T
T
TERMINAL 4
C
C
OPTIONAL
CHAMFER
ED
U
OPTIONAL
CHAMFER
ES
S
B
H DETAIL C
12 3
V
DETAIL C
J
F
G
2X D
SIDE VIEW
DUAL GAUGE
CONSTRUCTION
TOP VIEW 0.010 (0.254) M T
BOTTOM VIEW
SIDE VIEW
SINGLE GAUGE
CONSTRUCTION
N
R
T
M
P
L
DETAIL C
SEATING
PLANE
BOTTOM VIEW
OPTIONAL CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN
DIMENSIONS A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH OR GATE PROTRUSIONS. MOLD
FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.386 0.403 9.804 10.236
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
ED 0.045 0.055
ES 0.018 0.026
F 0.051 REF
1.143 1.397
0.457 0.660
1.295 REF
G 0.100 BSC
2.540 BSC
H 0.539 0.579 13.691 14.707
J 0.125 MAX
3.175 MAX
K 0.050 REF
1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R
0_
8_
0_
8_
S
0.116 REF
2.946 REF
U
0.200 MIN
5.080 MIN
V
0.250 MIN
6.350 MIN
SOLDERING FOOTPRINT*
10.490
16.155
8.380
2X
3.504
2X 1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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