M24C64-RDW3T/B View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

M24C64-RDW3T/B

128 Kbit, 64 Kbit and 32 Kbit serial I²C bus EEPROM

STMicroelectronics 

Initial delivery state

5

Initial delivery state

M24128, M24C64, M24C32

The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).

6

Maximum rating

Stressing the device outside the ratings listed in Table 7 may cause permanent damage to

the device. These are stress ratings only, and operation of the device at these, or any other

conditions outside those indicated in the Operating sections of this specification, is not

implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect

device reliability. Refer also to the STMicroelectronics SURE Program and other relevant

quality documents.

Table 7. Absolute maximum ratings

Symbol

Parameter

Min. Max. Unit

TA

TSTG

TLEAD

Ambient Operating Temperature

Storage Temperature

Lead Temperature during Soldering

PDIP-Specific Lead Temperature during Soldering

–40

130

°C

–65

150

°C

see note (1)

°C

260(2)

°C

VIO

Input or Output range

–0.50

6.5

V

VCC

Supply Voltage

–0.50

6.5

V

VESD

Electrostatic Discharge Voltage (Human Body model)(3) –4000 4000

V

1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®

7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)

2002/95/EU.

2. TLEAD max must not be applied for more than 10s.

3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω)

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