4N55/883B View Datasheet(PDF) - Avago Technologies

Part Name

Description

Manufacturer

4N55/883B

Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

Avago Technologies 

4N55*, 5962-87679, HCPL-553X, HCPL-653X,

HCPL-257K, HCPL-655X, 5962-90854, HCPL-550X

Hermetically Sealed, Transistor Output Optocouplers

for Analog and Digital Applications

Data Sheet

*See matrix for available extensions.

Description

These units are single, dual and quad channel, hermetically

sealed optocouplers.The products are capable of operation

and storage over the full military temperature range and

can be purchased as either standard product or with full

MIL-PRF-38534 Class Level H or K testing or from the ap-

propriate DLA Drawing. All devices are manufactured and

tested on a MIL-PRF-38534 certified line and are included

in the DLA Qualified Manufacturers List QML-38534 for

Hybrid Microcircuits.

Applications

 Military and Space

 High Reliability Systems

 Vehicle Command, Control, Life Critical Systems

 Line Receivers

 Switching Power Supply

 Voltage Level Shifting

 Analog Signal Ground Isolation

(see Figures 7, 8, and 13)

 Isolated Input Line Receiver

 Isolated Output Line Driver

 Logic Ground Isolation

 Harsh Industrial Environments

 Isolation for Test Equipment Systems

Features

 Dual Marked with Device Part Number and DLA

Drawing Number

 Manufactured andTested on a MIL-PRF-38534 Certified

Line

 QML-38534, Class H and K

 Five Hermetically Sealed Package Configurations

 Performance Guaranteed over Full Military

Temperature Range: -55°C to +125°C

 High Speed: Typically 400 kBit/s

 9 MHz Bandwidth

 Open Collector Output

 2-18 Volt VCC Range

 1500 Vdc Withstand Test Voltage

 High Radiation Immunity

 6N135, 6N136, HCPL-2530/2531,

Function Compatibility

 Reliability Data

The connection of a 0.1 μF bypass capacitor between VCC and GND is recommended.

CAUTION: It is advised that normal static precautions be taken in handling and assembly

of this component to prevent damage and/or degradation which may be induced by ESD.

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