Philips Semiconductors
BLC6G20-140; BLC6G20LS-140
UHF power LDMOS transistor
8. Package outline
Plastic flanged cavity package; 2 mounting slots; 2 leads
SOT895-1
D
F
A
D1
L
H U2
A
U1
B
q
C
c
1
w1 M A M B M
p
3
2
b
w2 M C M
E1
E
Q
0
5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
b
c
D
D1
E
E1
F
H
L
p
Q
q
U1
U2 w1 w2
mm
4.1 12.83 0.17
3.3 12.57 0.14
19.9 20.42 9.53 9.78 1.14 19.94 5.3
19.7 20.12 9.27 9.53 0.89 18.92 4.5
3.38
3.12
1.75
1.50
27.94
34.16
33.91
9.91
9.65
inches
0.161
0.130
0.505
0.495
0.0065
0.0055
0.785
0.775
0.804
0.792
0.375
0.365
0.385
0.375
0.045
0.035
0.785
0.745
0.209
0.177
0.133
0.123
0.069
0.059
1.100
1.345
1.335
0.390
0.380
0.25
0.01
0.6
0.023
OUTLINE
VERSION
IEC
SOT895-1
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-06-22
05-06-28
Fig 1. Package outline SOT895-1
BLC6G20-140_6G20LS-140_1
Objective data sheet
Rev. 01 — 30 January 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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