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C052/56G View Datasheet(PDF) - KEMET

Part NameC052/56G Kemet
KEMET Kemet
DescriptionMULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED


C052/56G Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
CERAMIC CONFORMALLY COATED/RADIAL
HIGH VOLTAGE “GOLD MAX”
RATINGS & PART NUMBER REFERENCE — C0G/NP0
Goldmax HV C6XX Series Special Lead Spacing per M49467 - C0G
Cap
1.0pF
1.5
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
.010uF
.012
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
.10
Cap
Code
109
159
229
279
339
399
479
569
689
829
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
Style
C617
C62X
(X=2, 3)
C62X
(X=7, 8)
C63X
(X=0,1)
C63X
(X=7, 8)
Cap
WVDC
WVDC
WVDC
WVDC
WVDC
Tol
500 1k 1.5k 2k 3k 500 1k 1.5k 2k 3k 500 1k 1.5k 2k 3k 500 1k 1.5k 2k 2.5k 3k 500 1k 1.5k 2k 2.5k 3k
C,D
C,D
C,D
C,D
C,D
C,D
C,D
C,D
C,D
C,D
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
Note: C6xx Series are commercial parts that meet special lead spacing requirements per MIL-PRF-49467.
Group A inspection per MIL-PRF-49467 is available upon request.
For packaging information, see pages 47 and 48.
© KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
23
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Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 

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