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C052/56G View Datasheet(PDF) - KEMET

Part NameC052/56G Kemet
KEMET Kemet
DescriptionMULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED


C052/56G Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
APPLICATION NOTES FOR MULTILAYER
CERAMIC CAPACITORS
TABLE 1
EIA TEMPERATURE CHARACTERISTIC CODES
FOR CLASS I DIELECTRICS
Significant Figure
of Temperature
Coefficient
Multiplier Applied
to Temperature
Coefficient
Tolerance of
Temperature
Coefficient *
PPM per Letter
Degree C Symbol
Multi-
plier
Number PPM per Letter
Symbol Degree C Symbol
0.0
C -1
0
±30
G
0.3
B -10
1
±60
H
0.9
A -100
2
±120
J
1.0
M -1000
3
±250
K
1.5
P -100000 4
±500
L
2.2
R +1
5
±1000 M
3.3
S +10
6
±2500 N
4.7
T +100
7
7.5
U +1000
8
+10000
9
* These symetrical tolerances apply to a two-point measurement of
temperature coefficient: one at 25°C and one at 85°C. Some deviation
is permitted at lower temperatures. For example, the PPM tolerance
for C0G at -55°C is +30 / -72 PPM.
TABLE 2
EIA TEMPERATURE CHARACTERISTIC CODES
FOR CLASS II & III DIELECTRICS
Low Temperature High Temperature Maximum Capacitance
Rating
Rating
Shift
Degree
Celcius
+10C
-30C
-55C
Letter Degree
Symbol Celcius
Z +45C
Y +65C
X +85C
+105C
+125C
+150C
+200C
Number
Symbol
Letter
Percent Symbol
2
±1.0% A
4
±1.5% B
5
±2.2% C
6
±3.3% D
7
±4.7% E
8
±7.5% F
9 ±10.0% P
±15.0% R
±22.0% S
+22 / -33% T
+22 / -56% U
+22 / -82% V
+10 +20 +30 +40 +50 +60 +70 +80
6
© KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.

 

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