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TS12001-C024DFNR View Datasheet(PDF) - Semtech Corporation

Part Name
Description
Manufacturer
TS12001-C024DFNR Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
FAupnpclitcioantiaolnDUessicnrgipAtioMnu(lctoi-nLtaiyneurePd)CB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed
when laying out this part on the PCB.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
JEDEC standard FR4 PCB Cross-section:
(square) Package Solder Pad
2 Plane
4 Plane
1.5748mm
Thermal Via
Component Traces
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
1.0142 - 1.0502 mm
Ground Plane
(1oz Cu)
Thermal Isolation
Power plane only
Package Solder Pad
(bottom trace)
0.5246 - 0.5606 mm
Power Plane
(1oz Cu)
0.0 - 0.071 mm Board Base
& Bottom Pad
Multi-Layer Board (Cross-sectional View)
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,
thickness of copper, etc.
TS12001
Final Datasheet
April 30, 2015
Rev 1.3
www.semtech.com
8 of 11
Semtech
 

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