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AD9058TD/883 View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
AD9058TD/883
ADI
Analog Devices ADI
AD9058TD/883 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
AD9058
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . . 106 × 108 × 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 × 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride
Die Attach . . . . . . . . . . . . . . . . . . . . Gold Eutectic (Ceramic)
Bond Wire . . . . . . . . . . . . 1–1.3 mil, Gold; Gold Ball Bonding
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
44-Lead J-Leaded Ceramic (J-44) Package
6
7
0.690 ± 0.012 SQ.
(17.5 ± 0.305)
0.650 ±0.008 SQ.
(16.51 ±0.203)
PIN 1 40
39
0.050 TYP
(1.27)
48-Lead Hermetic Ceramic DIP (D-48) Package
48
1
0.225 MAX
(5.72 MAX)
2.400 ± 0.024
(60.96 ± 0.609)
25
24
0.060 (1.52)
0.015 (0.38)
0.020 TYP
(0.508)
17
18
0.500 ±0.008
(12.70 ± 0.203)
29
28
0.135 (3.42)
MAX
0.017 (0.432)
TYP
0.630 ± 0.020
(16.0 ± 0.058)
0.037 ± 0.012
(0.940 ± 0.305)
0.023 (0.58)
0.014 (0.36)
0.110 (2,79)
0.090 (2.29)
0.70 MAX
(1.77 MAX)
0.62 (15.75)
0.59 (12.95)
0.015 (0.38)
0.008 (0.20)
0.63 (16.00)
0.52 (13.21)
0.150
(3.81)
MIN
–8–
REV. B
 

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