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Part Name
Description
CP275 View Datasheet(PDF) - Central Semiconductor
Part Name
Description
Manufacturer
CP275
Power Transistor
Central Semiconductor
CP275 Datasheet PDF : 0 Pages
PROCESS
CP275
Power Transistor
4.0 Amp NPN Silicon Power Transistor Chip
Central
TM
Semiconductor Corp.
PROCESS DETAILS
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
105 x 105 MILS
8.5 MILS
32 x 19 MILS
28 x 22 MILS
Al - 45,000Å
Ti/Ni/Ag - (300Å, 1,000Å, 10,000Å)
GEOMETRY
GROSS DIE PER 4 INCH WAFER
980
PRINCIPAL DEVICE TYPES
MJE13005
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R1 (28-March 2005)
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