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LM1117-5.0J3 View Datasheet(PDF) - Cystech Electonics Corp.

Part Name
Description
Manufacturer
LM1117-5.0J3
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
LM1117-5.0J3 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
CYStech Electronics Corp.
Recommended wave soldering condition
Spec. No. : C506J3
Issued Date : 2007.07.10
Revised Date :2011.08.11
Page No. : 6/8
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Pb-free Assembly
Average ramp-up rate
(Tsmax to Tp)
3°C/second max.
3°C/second max.
Preheat
Temperature Min(TS min)
100°C
150°C
Temperature Max(TS max)
Time(ts min to ts max)
150°C
60-120 seconds
200°C
60-180 seconds
Time maintained above:
Temperature (TL)
Time (tL)
183°C
60-150 seconds
217°C
60-150 seconds
Peak Temperature(TP)
240 +0/-5 °C
260 +0/-5 °C
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
Time 25 °C to peak temperature
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
LM1117-XXXJ3
CYStek Product Specification
 

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