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MMSF3P03HDR2 View Datasheet(PDF) - ON Semiconductor

Part Name
Description
Manufacturer
MMSF3P03HDR2
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MMSF3P03HDR2 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
MMSF3P03HD
100
VGS = 20 V
SINGLE PULSE
TC = 25°C
10
10 µs
100 µs
1 ms
10 ms
1
dc
RDS(on) LIMIT
0.1
THERMAL LIMIT
PACKAGE LIMIT
Mounted on 2sq. FR4 board (1sq. 2 oz. Cu 0.06
thick single sided), 10s max.
0.01
0.1
1
10
100
VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 12. Maximum Rated Forward Biased
Safe Operating Area
600
ID = 9 A
500
400
300
200
100
0
25
50
75
100
125
150
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 13. Maximum Avalanche Energy versus
Starting Junction Temperature
TYPICAL ELECTRICAL CHARACTERISTICS
10
1
D = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
0.001
1.0E−05
SINGLE PULSE
1.0E−04
1.0E−03
Normalized to θja at 10s.
Chip 0.0163 0.0652 0.1988 0.6411 0.9502
0.0307 F 0.1668 F
0.5541 F 1.9437 F
72.416 F Ambient
1.0E−02
1.0E−01
t, TIME (s)
1.0E+00
Figure 14. Thermal Response
1.0E+01
1.0E+02
1.0E+03
IS
tp
di/dt
trr
ta
tb
0.25 IS
IS
TIME
Figure 15. Diode Reverse Recovery Waveform
http://onsemi.com
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