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SA616 View Datasheet(PDF) - NXP Semiconductors.

Part NameDescriptionManufacturer
SA616 Low-voltage high performance mixer FM IF system NXP
NXP Semiconductors. NXP
SA616 Datasheet PDF : 31 Pages
First Prev 31
NXP Semiconductors
SA616
Low-voltage high performance mixer FM IF system
21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 5
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
9
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
10
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
11
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
12
Performance curves . . . . . . . . . . . . . . . . . . . . . 8
13
Application information. . . . . . . . . . . . . . . . . . 14
14
Test information . . . . . . . . . . . . . . . . . . . . . . . . 20
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
16
Soldering of SMD packages . . . . . . . . . . . . . . 25
16.1
Introduction to soldering . . . . . . . . . . . . . . . . . 25
16.2
Wave and reflow soldering . . . . . . . . . . . . . . . 25
16.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25
16.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26
17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 27
18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28
19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 29
19.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29
19.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
19.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
19.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
20
Contact information. . . . . . . . . . . . . . . . . . . . . 30
21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 June 2010
Document identifier: SA616
Direct download click here

 

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