74LVT374D View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
74LVT374D Datasheet PDF : 16 Pages
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NXP Semiconductors
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
74LVT374
3.3 V octal D-type flip-flop; 3-state
SOT163-1
D
y
Z
20
c
11
E
A
X
HE
vM A
pin 1 index
1
e
10
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8o
inches
0.1
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT163-1
IEC
075E04
REFERENCES
JEDEC
JEITA
MS-013
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT163-1 (SO20)
74LVT374
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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