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74AHC30BQ-Q100 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
74AHC30BQ-Q100
NXP
NXP Semiconductors. NXP
74AHC30BQ-Q100 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
74AHC30-Q100; 74AHCT30-Q100
8-input NAND gate
12. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
y
Z
14
pin 1 index
1
e
E
A
X
c
HE
vM A
8
A2
A1
7
bp
wM
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D(1) E(1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.05
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
0.01
0.004
0.028
0.012
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT108-1
IEC
076E06
REFERENCES
JEDEC
JEITA
MS-012
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 8. Package outline SOT108-1 (SO14)
74AHC_AHCT30_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 November 2013
© NXP B.V. 2013. All rights reserved.
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