Preliminary data
BUZ 103SL-4
Thermal Characteristics
Parameter
Thermal resistance, junction - soldering point 1)
Thermal resistance, junction - ambient 2)
Symbol
Values
Unit
min. typ. max.
RthJS -
RthJA -
tbd -
62.5 -
K/W
1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer,70µm thick) copper area for
Drain connection. PCB is vertical without blown air.
2) one channel active
Electrical Characteristics, at Tj = 25°C, unless otherwise specified
Parameter
Static Characteristics
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS=VDS, ID = 50 µA
Zero gate voltage drain current
VDS = 55 V, VGS = 0 V, Tj = -40 °C
VDS = 55 V, VGS = 0 V, Tj = 25 °C
VDS = 55 V, VGS = 0 V, Tj = 150 °C
Gate-source leakage current
VGS = 20 V, VDS = 0 V
Drain-Source on-resistance
VGS = 5 V, ID = 4.8 A
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
55
VGS(th)
1.2
IDSS
-
-
-
IGSS
-
RDS(on)
-
V
-
-
1.6
2
µA
-
0.1
0.1
1
-
100
nA
10
100
Ω
0.0403 0.055
Semiconductor Group
2
05/Sep/1997