DatasheetQ Logo
Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits

HCPL-0453 View Datasheet(PDF) - Avago Technologies

Part Name
Description
Manufacturer
HCPL-0453
AVAGO
Avago Technologies AVAGO
HCPL-0453 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4502/3)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 ± 0.15
(0.354 ± 0.006)
13.56
(0.534)
1
2
3
4
1.55
(0.061)
MAX.
4.00
(0.158)
MAX.
1.3
(0.051)
2.29
(0.09)
12.30 ± 0.30
(0.484 ± 0.012)
11.00
(0.433)
MAX.
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
1.00 ± 0.15
(0.039 ± 0.006)
Dimensions in millimeters (inches).
Lead coplanarity = 0.10 mm (0.004 inches).
Note: Floating lead protrusion is 0.25 mm (10 mils) max.
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
7° NOM.
Solder Reflow Temperature Profile
300
200
100
ROOM
TEMPERATURE
00
PREHEATING RATE
3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE
2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
2.5 C ± 0.5°C/SEC.
160°C
150°C
30
SEC.
140°C
3°C + 1°C/–0.5°C
30
SEC.
PREHEATING TIME
150°C, 90 + 30 SEC.
50
100
150
TIME (SECONDS)
PEAK
TEMP.
240°C PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
200
TIGHT
TYPICAL
LOOSE
250
Note: Non-halide flux should be used.
6
 

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]