DatasheetQ Logo
Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits

LM1114-5.0BM3-0-T2-G View Datasheet(PDF) - Cystech Electonics Corp.

Part Name
Description
Manufacturer
LM1114-5.0BM3-0-T2-G
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
LM1114-5.0BM3-0-T2-G Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
CYStech Electronics Corp.
Spec. No. : C505A3-B
Issued Date : 2003.03.21
Revised Date : 2014.01.03
Page No. : 9/15
Recommended wave soldering condition
Product
Peak Temperature
Pb-free devices
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Pb-free Assembly
Average ramp-up rate
(Tsmax to Tp)
3°C/second max.
3°C/second max.
Preheat
Temperature Min(TS min)
100°C
150°C
Temperature Max(TS max)
Time(ts min to ts max)
150°C
60-120 seconds
200°C
60-180 seconds
Time maintained above:
Temperature (TL)
183°C
217°C
Time (tL)
60-150 seconds
60-150 seconds
Peak Temperature(TP)
240 +0/-5 °C
260 +0/-5 °C
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
Time 25 °C to peak temperature
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
LM1114BM3/N3/A3
CYStek Product Specification
 

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]