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MTB010N06I3 View Datasheet(PDF) - Cystech Electonics Corp.

Part Name
Description
Manufacturer
MTB010N06I3
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
MTB010N06I3 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
CYStech Electronics Corp.
TO-251 Dimension
Spec. No. : C137I3
Issued Date : 2015.05.05
Revised Date :
Page No. : 8/ 8
Marking:
Product
Name
Date
Code
B010
N06
□□□□
1 23
Style: Pin 1.Gate 2.Drain 3.Source
3-Lead TO-251 Plastic Package
CYStek Package Code: I3
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
6.40
6.80
0.252 0.268
G
0.50
0.70 0.020 0.028
B
5.20
5.50 0.205 0.217
H
2.20
2.40 0.087 0.094
C
6.80
7.20 0.268 0.283
J
0.45
0.55 0.018 0.022
D
7.20
7.80 0.283 0.307
K
0.45
0.60
0.018 0.024
E
2.30 REF
0.091 REF
L
0.90
1.50 0.035 0.059
F
0.60
0.90
0.024 0.035
M
5.40
5.80 0.213 0.228
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB010N06I3
CYStek Product Specification
 

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