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H02N60SF 查看數據表(PDF) - Hi-Sincerity Microelectronics

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H02N60SF N-Channel Power Field Effect Transistor Hi-Sincerity
Hi-Sincerity Microelectronics Hi-Sincerity
H02N60SF Datasheet PDF : 6 Pages
1 2 3 4 5 6
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200504
Issued Date : 2005.05.01
Revised Date : 2005.09.28
Page No. : 4/6
TO-251 Dimension
A
M
Tab
F
C
G
1
2
3
K
H1
K1
a1
L
a1
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
I
0 2N6 0S
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
6.35 6.80
C
4.80 5.50
F
1.30 1.70
G
5.40 6.25
H1 6.75 8.00
K
0.50 0.90
K1 0.40 0.90
L
0.90 1.50
M
2.20 2.40
a1 0.40 0.65
a2
-
*2.30
*: Typical, Unit: mm
3-Lead TO-251
a2
a2
Plastic Package
HSMC Package Code: I
A
B
C
D
F
a1
y1
E
G
H
y1
J
K
H1
K1
a2
y2
a2
y2
M
a1
I
y1
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
I
0 2N6 0S
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
a1
3-Lead TO-251
Plastic Package
HSMC Package Code: I
DIM Min. Max.
A
6.40 6.80
B
-
6.00
C
5.04 5.64
D
-
*4.34
E
0.40 0.80
F
0.50 0.90
G
5.90 6.30
H
-
*1.80
H1
-
*9.30
I
- *16.10
J
-
*0.80
K
-
0.96
K1
-
*0.76
M
2.20 2.40
a1 0.40 0.60
a2 2.10 2.50
y1
-
5o
y2
-
3o
*: Typical, Unit: mm
H02N60SI, H02N60SJ, H02N60SE, H02N60SF
HSMC Product Specification
Direct download click here

 

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