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MT1389L View Datasheet(PDF) - MediaTek Inc

Part Name
Description
Manufacturer
MT1389L
MediaTek
MediaTek Inc MediaTek
MT1389L Datasheet PDF : 38 Pages
First Prev 31 32 33 34 35 36 37 38
V1.2
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE
13-2 Pre-process and Heat Treatment
Procedure: (MRT L3)
[Package opening] Æ [Baking] Æ [Humidification] Æ [Reflow]
MT1389L
Desktop DVD Player SOC
MTK CONFIDENTIAL, NO DISCLOSURE
带格式的: 项目符号和编号
A. Conditions between each step of procedure
Be lift for duration of 2 hours or longer at temperature of 30 oC or lower and a humidity of 60% R.H.
or lower.
B. Baking 125 oC, 24 hours.
C. Humidification: 30 oC, 60% R.H., 192 Hours
D. Reflow: 3 x 260oC
14 Manual Solder Condition
The specimen should be in the as-delivered condition. Set the soldering iron at a temperature of 300 +/- 10 oC
(at the iron bit). Place the iron and flux-cored solder in parallel with each and every terminal/lead on the back
of the board for a duration which does not exceed 5 seconds without applying any mechanical stress on the
component body.
It can also be applied under 350 +/- 10 oC at the iron bit within 3 seconds, please treat it carefully under such
condition.
The chip can’t do DIP soldering.
带格式的: 项目符号和编号
37
All information contained herein is the exclusive property of MediaTek Inc. and shall not be distributed, reproduced
or disclosed in whole or in part without prior written permission of MediaTek Inc
 

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