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2SJ239_ View Datasheet(PDF) - Toshiba

Part Name
Description
Manufacturer
2SJ239_
Toshiba
Toshiba Toshiba
2SJ239_ Datasheet PDF : 21 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Package List
1. Compact Surface-Mount Packages
To meet requirements for compact and thin equipment, Toshiba offers
various packages with power dissipation of 1.0 to 150 W and drain
current of 1 to 50 A.
In addition, we offer devices housed in the SOP-8 and TSSOP-8
packages. These devices consist of input/output isolated TFP Series
MOSFETs and trench MOSFETs with ultra-low ON-resistance.
100
10
NEW PS-8
NEW
VS-8 VS-6
SOP-8
NEW
TFP
TO-220
(SM)
PW-MOLD
SP
DP
1.0
PW-MINI
TO-3P
(SM)
q VS-6
0.1
0.1
1.0
10
100
1000
Power Dissipation PD (W)
6
4
Tape dimensions
4.0 ± 0.1
Unit: mm
0.95 1
3
0.3 ± 0.1
2.9 ± 0.2
0.05
0.25+00..1255
4.0 ± 0.1
Reel dimensions
1.4 ± 0.1
1.55 ± 0.1
9.5
Packing quantity
3000pcs / reel
37
 

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