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BA03TFP View Datasheet(PDF) - ROHM Semiconductor

Part Name
Description
Manufacturer
BA03TFP Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Regulator ICs
BAOOT / BAOOFP series
!Electrical characteristic curves
25
(1) 22.0
20
(1) Infinite heat sink, θ j-c = 5.7 (°C/W)
(2) 100 × 100 × 2 (mm3), with Al heat sink
(3) 50 × 50 × 2 (mm3), with Al heat sink
(4) No heat sink θ j-a = 62.5 (°C/W)
15
(2) 11.0
10
(3) 6.5
5
(4) 2.0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE : Ta (°C)
(Note) When Al thermal plate is used: Tightening torque: 6 (kg-cm) Apply silicon grease
Fig.6 Ta - power dissipation
characteristics (TO220FP)
12.5
(1) 10.0
10
(1) Infinite heat sink θ j-c=12.5 (°C/W)
(2) IC alone θ j-c=125.0 (°C/W)
7.5
5
2.5
(2) 1.0
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE : Ta ( °C )
Fig. 7 Ta - power dissipation
characteristics
(TO 252-3)
6
VCC = 10V IOUT = 0
BA05T
5
4
3
2
1
0
25 50 75 100 125 150 175 200
JUNCTION TEMPERATURE : Tj (°C)
Fig. 8 Thermal cutoff circuit
characteristics
10
VCC = 10V
BA05T
8
6
4
2
0
0
1.0
2.0
OUTPUT CURRENT : IOUT (A)
Fig. 9 Current limit characteristics
6
BA05T
5
4
3
2
1
0
0
10
20
30
40
50
INPUT VOLTAGE : VCC (V)
Fig. 10 Over voltage protection
characteristics
!External dimensions (Units : mm)
BA T series
10.0
+0.3
0.1
7.0
+0.3
0.1
φ3.1±0.1
4.5
+0.3
0.1
2.8
+0.2
0.1
BA FP series
6.5±0.2
5.0
+0.2
0.1
(2)
2.3±0.2
0.5±0.1
1.3
0.8
2.54±0.5
2.54±0.5
0.55
+0.1
0.05
2.6±0.5
(1) (2) (3)
TO220FP
(1) VCC
(2) GND
(3) OUT
0.65
2.3±0.2
(1)
0.65
2.3±0.2
(3)
TO252-3
0.5±0.1
(1) VCC
(2) GND
(3) OUT
 

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