Philips Semiconductors
74LVT162374
3.3 V 16-bit edge-triggered D-type flip-flop
13. Package outline
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
D
y
Z
48
c
25
E
A
X
HE
vM A
pin 1 index
1
e
A2
A1
24
wM
bp
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT362-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT362-1 (TSSOP48)
9397 750 14401
Product data sheet
Rev. 03 — 17 January 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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