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M1A3P400-2FGG144ES View Datasheet(PDF) - Unspecified

Part Name
Description
Manufacturer
M1A3P400-2FGG144ES Datasheet PDF : 196 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
1 – ProASIC®3 Flash Family FPGAs
with Optional Soft ARM Support
Product Brief
®
Features and Benefits
High Capacity
• 15 k to 1 M System Gates
• Up to 144 kbits of True Dual-Port SRAM
• Up to 300 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Live at Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
High Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI†
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced
Encryption Standard (AES) Decryption (except ARM®-
enabled ProASIC®3 devices) via JTAG (IEEE 1532–
compliant)†
• FlashLock® to Secure FPGA Contents
Low Power
• Core Voltage for Low Power
• Support for 1.5 V-Only Systems
• Low-Impedance Flash Switches
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, BLVDS, and
M-LVDS (A3P250 and above)
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold Sparing I/Os‡
• Programmable Output Slew Rate† and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL†
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase-Shift, Multiply/Divide, Delay
Capabilities and External Feedback
• Wide Input Frequency Range (1.5 MHz to 350 MHz)
Embedded Memory†
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit
RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
• True Dual-Port SRAM (except ×18)
ARM Processor Support in ProASIC3 FPGAs
• M1 and M7 ProASIC3 Devices—Cortex-M1 and
CoreMP7 Soft Processor Available with or without
Debug
Table 1-1 • ProASIC3 Product Family
ProASIC3 Devices
ARM7 Devices1
Cortex-M1 Devices1
A3P015
System Gates
15 k
Typical Equivalent Macrocells 128
VersaTiles (D-flip-flops)
384
RAM kbits (1,024 bits)
–
A3P030 A3P060 A3P125 A3P250 A3P400
M1A3P250 M1A3P400
30 k 60 k 125 k 250 k
400 k
256 512 1,024
–
–
768 1,536 3,072 6,144
9,216
–
18
36
36
54
A3P600 A3P1000
M7A3P1000
M1A3P600 M1A3P1000
600 k
1M
–
–
13,824
24,576
108
144
4,608-Bit Blocks
–
–
4
8
8
12
24
32
FlashROM Bits
Secure (AES) ISP2
1k
1k
1k
1k
1k
1k
1k
1k
–
–
Yes
Yes
Yes
Yes
Yes
Yes
Integrated PLL in CCCs
VersaNet Globals3
–
–
1
1
1
1
1
1
6
6
18
18
18
18
18
18
I/O Banks
2
2
2
2
4
4
4
4
Maximum User I/Os
49
81
96
133
157
194
235
300
Package Pins
QFN
VQFP
TQFP
PQFP
FBGA
QN68
QN132
VQ100
QN132
VQ100
TQ144
FG144
QN132 QN1325
VQ100 VQ100
TQ144
PQ208 PQ208
PQ208
FG144 FG144/2565 FG144/256/
484
PQ208
FG144/256/
484
PQ208
FG144/256/
484
Notes:
1. Refer to the CoreMP7 datasheet or Cortex-M1 product brief for more information.
2. AES is not available for ARM-enabled ProASIC3 devices.
3. Six chip (main) and three quadrant global networks are available for A3P060 and above.
4. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs with Optional
ARM Support handbook.
5. The M1A3P250 device does not support this package.
† A3P015 and A3P030 devices do not support this feature.
‡ Supported only by A3P015 and A3P030 devices.
February 2008
Product Brief
1-1
© 2008 Actel Corporation
 

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