M1A3P400-2FGG144ES View Datasheet(PDF) - Unspecified
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M1A3P400-2FGG144ES Datasheet PDF : 196 Pages
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ProASIC3 DC and Switching Characteristics
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient temperature. This is an important distinction because dynamic and static power
consumption cause the chip junction to be higher than the ambient temperature.
EQ 2-1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 2-1
where:
TA = Ambient Temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θja * P
θja = Junction-to-ambient of the package. θja numbers are located in Table 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θjc and the junction-to-ambient air thermal
resistivity is θja. The thermal characteristics for θja are shown for two air flow rates. The absolute
maximum junction temperature is 110°C. EQ 2-2 shows a sample calculation of the absolute
maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and
in still air.
Maximum Power Allowed = -M-----a---x--.----j-u----n---c---t-i--o---n-----t--e---m-----p----.-----(--°--C----)----–----M-----a---x---.---a---m-----b----i-e---n---t----t--e---m-----p---.----(--°--C-----) = 1----1---0----°---C-----–-----7---0----°--C--- = 1.951 ·W
θ j a ( ° C/W)
20.5°C/W
EQ 2-2
Table 2-5 • Package Thermal Resistivities
Package Type
Quad Flat No Lead
Device
A3P030
θja
Pin Count θjc Still Air 200 ft./min. 500 ft./min. Units
132
0.4 21.4
16.8
15.3
C/W
A3P060
132
0.3 21.2
16.6
15.0
C/W
A3P125
132
0.2 21.1
16.5
14.9
C/W
A3P250
132
0.1 21.0
16.4
14.8
C/W
Very Thin Quad Flat Pack (VQFP)
All devices 100 10.0 35.3
29.4
27.1
C/W
Thin Quad Flat Pack (TQFP)
All devices 144 11.0 33.5
28.0
25.7
C/W
Plastic Quad Flat Pack (PQFP)
All devices 208
8.0 26.1
22.5
20.8
C/W
PQFP with embedded heatspreader All devices 208
3.8 16.2
13.3
11.9
C/W
Fine Pitch Ball Grid Array (FBGA)
See note*
144
3.8 26.9
22.9
21.5
C/W
See note*
256
3.8 26.6
22.8
21.5
C/W
See note*
484
3.2 20.5
17.0
15.9
C/W
A3P1000
144
6.3 31.6
26.2
24.2
C/W
A3P1000
256
6.6 28.1
24.4
22.7
C/W
A3P1000
484
8.0 23.3
19.0
16.7
C/W
* This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.
v1.1
2-5
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