W25Q32FVDAIF View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W25Q32FVDAIF

3V 32M-Bit Serial Flash Memory

Winbond 

3. PACKAGE TYPES AND PIN CONFIGURATIONS

3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil

W25Q32FV

Figure 1a. W25Q32FV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)

3.2 Pad Configuration WSON 6x5-mm / 8x6-mm

Figure 1b. W25Q32FV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP / ZE)

3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm

PIN NO.

PIN NAME

I/O

FUNCTION

1

/CS

I

Chip Select Input

2

DO (IO1)

I/O

Data Output (Data Input Output 1)(1)

3

/WP (IO2)

I/O

Write Protect Input ( Data Input Output 2)(2)

4

GND

Ground

5

DI (IO0)

I/O

Data Input (Data Input Output 0)(1)

6

CLK

I

Serial Clock Input

7

/HOLD or /RESET

(IO3)

I/O

Hold or Reset Input (Data Input Output 3)(2)

8

VCC

Power Supply

Notes:

1. IO0 and IO1 are used for Standard and Dual SPI instructions

2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.

Publication Release Date: Sept 16,, 2013

-6-

Revision H

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