W25Q32FVSSIF View Datasheet(PDF) - Winbond

Part Name

Description

Manufacturer

W25Q32FVSSIF

3V 32M-Bit Serial Flash Memory

Winbond 

W25Q32FV

10.5 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 91

10.6 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 92

10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 93

10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 94

11. ORDERING INFORMATION .......................................................................................................... 95

11.1 Valid Part Numbers and Top Side Marking ........................................................................ 96

12. REVISION HISTORY...................................................................................................................... 97

Publication Release Date: Sept 16,, 2013

-4-

Revision H

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