NXP Semiconductors
BCP51; BCX51; BC51PA
45 V, 1 A PNP medium power transistors
1.05
2.3
0.6 0.55
2.1
1.3
0.5 (2×)
0.4 (2×)
0.5 (2×) 0.6 (2×)
0.25
1.1 1.2
0.25 0.25
0.4
0.5
1.6
1.7
solder paste = solder lands
solder resist
occupied area
Dimensions in mm
sot1061_fr
Reflow soldering is the only recommended soldering method.
Fig 26. Reflow soldering footprint SOT1061 (HUSON3)
BCP51_BCX51_BC51PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 13 October 2011
© NXP B.V. 2011. All rights reserved.
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