AMD
TYPICAL THERMAL CHARACTERISTICS
Measured at 25°C ambient. These parameters are not tested.
Parameter
Symbol Parameter Description
θjc
Thermal impedance, junction to case
θja
Thermal impedance, junction to ambient
θjma
Thermal impedance, junction to
ambient with air flow
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
Typ
PLCC
14
39
33
30
27
25
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Plastic θjc Considerations
The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
14
MACH110-12/15/20