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H06N60E 查看數據表(PDF) - Hi-Sincerity Mocroelectronics

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H06N60E N-Channel Power Field Effect Transistor HSMC
Hi-Sincerity Mocroelectronics HSMC
H06N60E Datasheet PDF : 6 Pages
1 2 3 4 5 6
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200402
Issued Date : 2004.04.01
Revised Date : 2005.03.10
Page No. : 4/6
TO-220AB Dimension
A
D
B
F
E
H
I
3
G
2
1
Tab
P
L
M
O
J
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
C
Normal: None H
E
0 6N60
Date Code
Control Code
K
Note: Green label is used for pb-free packing
N
Pin Style: 1.Gate 2 & Tab.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
5.58 7.49
B
8.38 8.90
C
4.40 4.70
D
1.15 1.39
E
0.35 0.60
F
2.03 2.92
G
9.66 10.28
H
- *16.25
I
-
*3.83
J
3.00 4.00
K
0.75 0.95
L
2.54 3.42
M
1.14 1.40
N
-
*2.54
O 12.70 14.27
P 14.48 15.87
*: Typical, Unit: mm
TO-220FP Dimension
A
α1
D
α2
α3
α4
α5
EO
C
G
I
N
J
3
F
2
K
1
M
L
3-Lead TO-220FP
Plastic Package
HSMC Package Code: F
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None H
F
0 6N60
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
C
D
E
F
G
I
J
K
L
M
N
O
α1/2/4/5
α3
Min.
6.48
4.40
2.34
0.45
9.80
3.10
2.70
0.60
2.34
12.48
15.67
0.90
2.00
-
-
Max.
7.40
4.90
3.00
0.80
10.36
3.60
3.43
1.00
2.74
13.60
16.20
1.47
2.96
*5o
*27o
*: Typical, Unit: mm
H06N60U, H06N60E, H06N60F
HSMC Product Specification
Direct download click here

 

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