LT1019CS8-4.5 View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LT1019CS8-4.5 Datasheet PDF : 12 Pages
| |||
U
PACKAGE DESCRIPTIO
LT1019
H Package
8-Lead TO-5 Metal Can (0.200 PCD)
(LTC DWG # 05-08-1320)
0.040
(1.016)
MAX
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
45°TYP
0.028 – 0.034
(0.711 – 0.864)
0.027 – 0.045
(0.686 – 1.143)
PIN 1
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
REFERENCE
PLANE
0.016 – 0.021**
(0.406 – 0.533)
OBSOLETE
0.200
(5.080)
TYP
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
H8(TO-5) 0.200 PCD 1197
0.300 – 0.325
(7.620 – 8.255)
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
0.400*
(10.160)
MAX
8
7
6
5
0.009 – 0.015
(0.229 – 0.381)
0.065
(1.651)
TYP
+0.035
0.325 –0.015
( ) 8.255
+0.889
–0.381
0.100
(2.54)
BSC
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.125
(3.175)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.020
(0.508)
MIN
0.255 ± 0.015*
(6.477 ± 0.381)
12
34
N8 1098
S8 Package
8-Lead Plastic Small Outline (Narrow 0.150)
(LTC DWG # 05-08-1610)
.050 BSC
.245
MIN
.045 ±.005
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
.160 ±.005
.053 – .069
(1.346 – 1.752)
0°– 8° TYP
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
.228 – .244
(5.791 – 6.197)
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
.150 – .157
(3.810 – 3.988)
NOTE 3
SO8 0303
1
2
34
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
1019fd
11
|
|
Share Link: 