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H11B815SD データシートの表示(PDF) - Fairchild Semiconductor

部品番号
コンポーネント説明
メーカー
H11B815SD
Fairchild
Fairchild Semiconductor Fairchild
H11B815SD Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Package Dimensions (Through Hole) Package Dimensions (0.4" Lead Spacing)
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
0.190 (4.83)
0.175 (4.45)
0.200 (5.08)
0.115 (2.92)
0.270 (6.86)
0.250 (6.35)
0.154 (3.90)
0.120 (3.05)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
15°
0.300 (7.62)
typ
0.190 (4.83)
0.175 (4.45)
0.200 (5.08)
0.115 (2.92)
0.270 (6.86)
0.250 (6.35)
0.016 (0.40)
0.008 (0.20)
0.154 (3.90)
0.120 (3.05)
0.004 (0.10)
MIN
0.100 (2.54)
TYP
0.400 (10.16)
TYP
0 to 15°
0.016 (0.40)
0.008 (0.20)
Package Dimensions (Surface Mount)
PCB Footprint Layout
0.270 (6.86)
0.250 (6.35)
0.190 (4.83)
0.175 (4.45)
0.300 (7.62)
TYP
0.200 (5.08)
0.115 (2.92)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.100 (2.54)
TYP
0.022 (0.56)
0.016 (0.41)
Lead Coplanarity 0.004 (0.10) MAX
0.315 (8.00)
MIN
0.405 (10.30)
MAX
NOTE
All dimensions are in inches (millimeters)
0.016 (0.40)
0.008 (0.20)
0.295 (7.49)
0.415 (10.54)
0.070 (1.78)
0.060 (1.52)
0.100 (2.54)
0.030 (0.76)
6
www.fairchildsemi.com
H11B815 Rev. 1.0.1
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