H11B815.S View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
H11B815.S Datasheet PDF : 9 Pages
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Recommended Thermal Reflow Profile for Surface Mount DIP Package
Temperature (°C)
250
200
150
100
50
0
0
1
225°C
220°C: 10 sec to 40 sec
Time > 183°C: 120 sec to 180 sec
2
3
4
5 Time (Min)
5
www.fairchildsemi.com
H11B815 Rev. 1.0.1
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