Features
Glass passivated junction chip
For surface mounted application
Low profile package
Built-in strain rellef
Ideal for automated placement
Easy pick and place
Super fast recovery time for high efficiency
Glass passivated chip junction
High temperature soldering:
260℃/10 seconds at terminals
Plastic material used carries Underwriters
Laboratory Classification 94V-0
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
Cases: Molded plastic
Terminals: Pure tin plated, lead free
Polarity: Indicated by cathode band
Packing: 12mm tape per EIA STD RS-481
Weight: 0.064 grams
Ordering Information (example)
ES1A - ES1J
1.0AMP. Surface Mount Super Fast Rectifiers
SMA/DO-214AC
Part No. Package
Packing
Packing
code
Green Compound
Packing code
ES1A
SMA 1.8K / 7" REEL
R3
R3G
Maximum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Maximum Recurrent Peak Reverse Voltage
Symbol
ES
1A
VRRM
50
Maximum RMS Voltage
VRMS
35
Maximum DC Blocking Voltage
VDC
50
Maximum Average Forward Rectified Current
IF(AV)
Peak Forward Surge Current, 8.3 ms Single Half Sine-wave
Superimposed on Rated Load (JEDEC method)
IFSM
Maximum Instantaneous Forward Voltage (Note 1)
@1A
VF
Maximum DC Reverse Current at Rated @ TA=25 ℃
DC Blocking Voltage
@ TA=125 ℃
IR
Maximum Reverse Recovery Time (Note 2)
Trr
Typical Junction Capacitance (Note 3)
Cj
Maximum Thermal Resistance
RθJA
RθJL
Operating Temperature Range
TJ
Storage Temperature Range
TSTG
Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied VR=4.0 Volts
ES ES ES ES ES ES ES
1B 1C 1D 1F 1G 1H 1J
100 150 200 300 400 500 600
70 105 140 210 280 350 420
100 150 200 300 400 500 600
1
30
0.95
1.3
1.7
5
100
35
16
18
85
35
- 55 to + 150
- 55 to + 150
Units
V
V
V
A
A
V
uA
uA
nS
pF
OC/W
OC
OC
Version:H13