BY228 View Datasheet(PDF) - Philips Electronics
Part Name
Description
Manufacturer
BY228 Datasheet PDF : 7 Pages
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Philips Semiconductors
Damper diode
Product specification
BY228
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack
• Also available with preformed leads
for easy insertion.
APPLICATIONS
• Damper diode in high frequency
horizontal deflection circuits up to
16 kHz.
DESCRIPTION
Rugged glass package, using a high
temperature alloyed construction.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
,2/3 pagek(Datasheet)
a
MAM104
Fig.1 Simplified outline (SOD64) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VRSM
VRRM
VR
IFWM
IFRM
IFSM
Tstg
Tj
non-repetitive peak reverse voltage
repetitive peak reverse voltage
continuous reverse voltage
working peak forward current
repetitive peak forward current
non-repetitive peak forward current
storage temperature
junction temperature
Tamb = 75 °C; PCB mounting (see
Fig.4); see Fig.2
t = 10 ms half sinewave;
Tj = Tj max prior to surge;
VR = VRRMmax
MIN.
−
−
−
−
−
−
−65
−65
MAX.
1 650
1 650
1 500
5
UNIT
V
V
V
A
10 A
50 A
+175 °C
+150 °C
ELECTRICAL CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
VF
forward voltage
IR
reverse current
trr
reverse recovery time
tfr
forward recovery time
CONDITIONS
IF = 5 A; Tj = Tj max; see Fig.3
IF = 5 A; see Fig.3
VR = VRmax; Tj = 150 °C
when switched from IF = 0.5 A to IR = 1 A;
measured at IR = 0.25 A; see Fig.6
when switched to IF = 5 A in 50 ns;
Tj = Tj max; Fig.7
MAX.
1.4
1.5
150
1
UNIT
V
V
µA
µs
1 µs
1996 Sep 26
2
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