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BAT30-ALFILM View Datasheet(PDF) - STMicroelectronics

Part NameDescriptionManufacturer
BAT30-ALFILM Small signal Schottky diodes ST-Microelectronics
STMicroelectronics ST-Microelectronics
BAT30-ALFILM Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Characteristics
BAT30
Figure 5.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a)/Rth(j-a)
1.E+00
Single pulse
SOT-666
Epoxy printed board FR4
Coppr thickness = 35 µm
Figure 6.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a) /Rth(j-a)
1.E+00
Single pulse
SOD-923
1.E-01
1.E-01
1.E-02
1.E-03
1.E-02
tP(s)
1.E-01
1.E+00
1.E+01
tP(s)
1.E-02
1.E-03
1.E-02
1.E-01
1.E+00 1.E+01 1.E+02 1.E+03
Figure 7.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
1.E+00
Zth(j-a)/Rth(j-a)
Single pulse
SOD-523
1.E-01
Epoxy printed board FR4
Coppr thickness = 35 µm
1.E-02
1.E-03
1.E-03
1.E-02
tP(s)
1.E-01
1.E+00
1.E+01
Figure 8.
Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-923)
Rth(j-a)(°C/W)
900
800
700
Epoxy printed board FR4
Copper thichness = 35 µm
600
500
400
300
200
100
SCU(cm²)
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Figure 9.
Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
Rth(j-a)(°C/W)
600
500
Epoxy printed board FR4
Copper thichness = 35 µm
400
300
200
0
SCU(mm²)
5
10 15 20 25 30 35 40 45 50
Figure 10. Leakage current versus reverse
applied voltage (typical values)
IR (µA)
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
0
5
Tj=150°C
Tj=125°C
Tj=85°C
Tj=25°C
10
15
20
VR (V)
25
30
4/14
Doc ID 12564 Rev 3
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